photolithography processing systems

for markets such as semiconductor, MEMS, glass and optical component industries and flat panel industries.

PRODUCTS

Resist Processing

Automatic production systems


VARIXX-SERIES

  • Flexible configuration of processing modules
  • Available modules: spin coater, developer, temperature and smart-EBR
  • Handling thin, standard or bonded wafer (Si, glass & others)
  • Round wafer up to Ø300 mm (Ø12 inch)
  • Square substrates size up to 230 x 230 mm (9 x 9 inch)

Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.

 

Designed to be used in applications:
SPIN (SPRAY) COATING, DEVELOPING, BAKING AND EBR

VARIXX 804 
(Ø200mm) with 4 process modules

VARIXX 806 
(Ø200mm) with 6 process modules

VARIXX 1204 
(Ø300mm) with 4 process modules


Semi-automatic production systems


UNIXX-SERIES

  • Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone, table-top or bench mounted configurations.
  • Base frame design allows various process modules configurations.
  • Round wafer up to Ø300 mm (Ø12 inch)
  • Square substrate size up to 230 x 230 mm (9 x 9 inch)

Our product range also offers customized single processing systems for large substrates up to 1.300 x 1.300 mm (51 x 51 inch).

Optional sub-systems; PR dispense systems (pumps, syringe or CPD).

 

Designed to be used in applications:
SPIN OR SPRAY COATING, DEVELOPING, BAKING & COOLING AND EBR

SPIN COATER - CCP

UNIXX S760+
(21x21 inch) Stand-alone system
spin coater for large substrates.

UNIXX SA30+ 
(Ø300mm) Stand-alone system with
covered chuck
spin coater. (single base frame)

UNIXX SHp22+
(Ø200mm) Stand-alone system with
covered chuck spin coater & hotplate module.


SPIN COATER - open bowl

UNIXX SA30
(Ø300mm) Stand-alone system with
open bowl
spin coater. (single base frame)

UNIXX SHp22 
(Ø200mm) Stand-alone system with
open bowl spin coater & hotplate module.


DEVELOPER

UNIXX D20
(Ø200mm) Stand-alone system for developing or etching.



EBR

UNIXX EBR A20
(200x200mm) Stand-alone smartEBR system.(single base frame)




HOTPLATES

UNIXX H1403
(40x40 inch) Stand-alone hotplate system with 3 hotplate modules up to 1.000 x 1.000mm substrates.

UNIXX H760
(21x21 inch) Stand-alone hotplate system up to 537 x 537mm or customized rectangular substrates.

UNIXX He45 
(Ø450mm) Stand-alone hotplate system for round or up to 320 x 320mm square
substrates.

 

UNIXX HvA20 
(Ø200mm) Stand-alone hotplate system for HMDS priming and vacuum dehydration bake.
(available as table-top or bench mounted)

UNIXX HeT20 
(Ø200mm) Table-top hotplate tool with electronic driven lifting pins.
(or bench mounted)

UNIXX HpT20 
(Ø200mm) Table-top hotplate tool with pneumatic driven lifting pins.
(or bench mounted)


SPRAY COATER

3D & 2D SPRAY COATER SYSTEM for flat, concave or convex surfaces

  • For large scale optical devices and substrates up to 21‟x 21‟
  • 6 axis robot system & up to 2 ultra-sonic spray nozzles
  • Integrated heating chuck under the spray coating area

SPRAY COATER MODULE for surfaces with topographic structure

  • Wafer size up to Ø 300 mm (Ø12‟)
  • Module can be installed in automatic systems

Optional sub-systems; PR dispense systems (pumps and syringe).

UNIXX SP 760
(21x21 inch) Spray coater system with integrated heating chuck for large substrates.

UNIXX SP H22
(Ø200mm) Spray coater system with hotplate module.

UNIXX SP B20
(Ø200mm)
Bench mounted spray coater module.

 

Laboratory spinner systems


BASIXX-SERIES

  • Software control with recipe management function
  • Transparent cover with safety interrupt sensor
  • Solvent injection over puddle nozzle
  • Process bowl and splash ring removable for cleaning
  • Round wafer up to Ø200mm (Ø8 inch)
  • Square substrates size up to 150 x 150 mm (6 x 6 inch)
  • Available as bench mounted, table-top or stand-alone unit
  • Simply and cost-effective

Optional (+) electric media arm

ADDITIONAL OPTIONS

  • Media pump PD-10 for PR
  • Media- and waste tanks
  • External media supply (e.g. N2)

 

Designed to be used in applications:
SPIN COATING, DEVELOPING, CLEANING AND DRYING

BASIXX ST20+
(Ø200mm) Table top tool with electric media arm.

BASIXX SB20+
(Ø200mm) Bench mounted module with electric media arm.


 


BASIXX ST20
(Ø200mm)
Table top tool with simple dispense over one puddle nozzle.

 

BASIXX SH22
(Ø200mm) Stand-alone system with simple dispense over one puddle nozzle and hotplate module.


WET PROCESSING

Semi- or fully-automatic production systems

CHEMIXX-SERIES
MECHANICAL PROCESSING

  • High pressure nozzle
  • Megasonic or ultra-sonic nozzle
  • Large area megasonic
  • Single or double-sided brush

 
CHEMICAL PROCESSING

  • SPM, SC1, SC2, DHF
  • BHF, SiO2, Metal etch
  • Chemicals via puddle or spray nozzle


Pre-defined systems for standard processes such as mask cleaning,
metal lift-off, post CMP clean and scrubbers or customized tools.

 

Designed to be used in applications:
WET CLEANING, ETCHING, POST CMP CLEAN AND METAL LIFT-OFF

CHEMIXX CL30pm
(Ø300mm) Wet cleaning system with
DI-Chamber rinse (optional).

CHEMIXX CMP30pm
(Ø300mm) Wet cleaning system for cleaning of dry and wet wafers after CMP.

CHEMIXX E 30 MASK
(9x9 inch) Photomask cleaning system.
 

 

CHEMIXX 760
(21x21 inch) Single processing cleaning, etching or developing system with integrated media supply for large substrates.

CHEMIXX 801
(Ø200mm) Automatic etching processing
system with one process chamber.

CHEMIXX 803
(Ø200mm) Automatic wet processing
system with three process chamber.


TEMPORARY BONDING

Manual to automatic production systems


AFIXX-SERIES

  • Wafer sizes from pieces up to Ø200 mm (Ø8 inch)
  • Suitable for very thin fragile wafers (< 40 μm) and flexible plastic materials.
  • Compatible with silicon, compound and glass materials
  • Uniform and repeatable mounting process is ideal for CMP, grinding, polishing and etching.


Temporary bonding material mroBOND L1.1.DS are organic coatings that enable back-end-of-line (BEOL) processing of ultra-thin wafers using standard semiconductor equipment.

MOUNTING ONTO DIFFERENT TYPES OF CARRIER SUBSTRATES: GLASS, SAPPHIRE, SILICON OR CERAMIC.

Designed to be used in applications:
TEMPORARY BONDING

AFIXX 22a
(Ø200mm) Automatic system with
hotplate & I/O stations.

AFIXX 20s
(Ø200mm) Semi-automatic system
with 200ºC hotplate.

AFIXX 20m
(Ø200mm) Manual system with 200ºC hotplate.

DEBONDING

Manual to automatic production systems


DEFIXX-SERIES

  • Wafer sizes from pieces up to Ø300 mm (Ø12 inch)
  • Imbedded heaters on wafer and carrier plates
  • Compatible with silicon, compound and glass materials
  • Usable with a wide range of debonding materials


It is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production.
DEMOUNTING OF BACKSIDE GROUND, THINNED AND POLISHED WAFERS.

Designed to be used in applications:
DEBONDING

DEFIXX 20a
(Ø200mm) Automatic system with robot loading and unloading. (cassette to cassette)

DEFIXX 20s
(Ø200mm) Semi-automatic system with manual loading and unloading station.



DEFIXX 30m
(Ø300mm) Manual system with imbedded heaters on wafer and carrier plates.


DEFIXX 15m
(Ø150mm) Manual system with imbedded heaters on wafer and carrier plates.




SUB-SYSTEMS


In addition to our processing systems Osiris International also offers sub-systems (e.g. dispensing systems, media supply cabinets with various canister designs).


Dispensing systems

OOPXX
Oyster dispensing pump
(max. dispense volume 100ml or 200ml)

For high material viscosity:
Photoresist positive & negative, bonding material or solvent.

  • Programmable  pressure, rate and speed
  • Incl. suck-back valve
     

PD-10
Pneumatic diaphragm pump system
Handles a wide range of media viscosities, from solvents up to photoresist.

FOR APPLICATIONS

  • Photoresist coating for SEMI applications
  • Edge cleaning with solvents
  • Protective coating

Syringe
Automatic syringe dispense system
Dispensing of small media amounts or continuous dispense for μl/sec or any ml/sec

  • Syringe made of glass or one-way syringe of plastic
  • Different syringe sizes available: 10ml, 20ml, 50ml, 100ml and 200ml
  • Programmable suck-back volume and rate

Media supply cabinets

Active media cabinet
Storage up to three acid-canister
PE-HD 10 ltr. tank

Various media canister designs

  • Canister sizes: 5, 10, 20 ltr.
  • Canister Materials: SS, PP, HDPE, PVDF
  • Media can be heated or temperature stabilized
  • Continuous Pump with ultrasonic flow sensor or pressurized tank with manual flow mtr.